| Other Directions of Activity / Microelectronics |

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Microelectronics
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Federal State Unitary Plant "IZHEVSKY MEKHANICHESKY ZAVOD" develops, manufactures and supplies Microelectronics`
Products based on thick-film & thin-film hybrid and solid-state CMOS technologies. The products are small-size and highly
reliable.
Production process of microelements comprises an integral production cycle involving the design works and
pilot specimens followed by large-scale production of articles.
The Enterprise fabricates the microelectronics items for special and medical purposes and following
appliances:
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Commutator motor control modules upto 2 kW in hybrid version able to limitate the start-up currents, to
control no-load rpm, to stabilize motor`s rpm in operation, to retain maximum over-load currents at preset level and to ensure
the current & thermal motor protection.
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Special LSICs and electronic modules in hybrid version (HIC). The Enterprise disposes state-of-the-art
industrial lines and highly qualified personnel for their operation and maintenance.
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Special ICs to control all-purpose food-processors and telecommunication facilities; ICs for FM-mode radio
sets.
FSUP "IMZ" welcomes any Customer orders to supply electronic units for the car engine control devices, mobile
radio telecommunications, commu-tator motor control units, special process equipment, technical and medical appliances etc.
as well as invites the foreign manufacturers and consumers of microelectronics to a partnership in any joint projects.
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| Solid-State Production |
| Type of technology |
CMOS with aluminium and polycrystalline silicon gates |
| Ultimate frequency with aluminium gate, MHz |
2 |
| Ultimate frequency with polysilicon gate, MHz |
10 |
| Design standards, mcm |
up to 2 |
| Assembly |
in metal-ceramic package |
| Sealing |
by soldering or seam welding |
| Chip production capacity, pcs/year |
500 000 |
| Thick-Film Production |
| Type of substrate |
ceramics, metal |
| Paste |
silver-cadmium, ruthenium or stannate |
| Number of processed layers |
up to 5 |
| Number of resistors on 48x60 mm substrate at 2-layer wiring |
up to 100 |
| Precision of resistors, % |
2 |
| Scatter power of resistive layer, mW/mm2 |
50 |
| Components used |
w/supple or polyamide-based leads, surface-mounted components |
| Sealing |
w/elastic compound or purchased package |
| Production capacity |
100 000 ICs per year |
| Thin-Film Production |
| Type of substrate |
cytall, polycor |
| Method of spraying |
vacuum-thermal |
| Lead & resistor width, min, mm |
0,05 |
| Precision of resistors, % |
+ 0,5 |
| Scatter power of resistive layer, mW/mm2 |
30 |
| Package |
metal & glass |
| Sealing |
by laser |
| Production capacity |
50 000 ICs per year |
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